FCB3
- Main control boards are lead free
- GHG Factor 2.43
- Resource Factor 1.44 (Ref. Product: FCB2M)
Description
Flip chip bonder
High quality and high productivity bonding of narrow-pitch ICs
- High accuracy of 3µm/3̌ and high speed mounting at 1.8 s/chip have been achieved
- High flexibility makes it adaptable to a wide variety of production styles
- Modular feed system and bond head. By applying changeable bonding head unit and die supply system FCB3 will keep up with the latest and furture process requirements.
- The high cleanliness design and the front-supply system for 300-mm wavers facilite production changeover.
Specifications
| Model No. | NM-SB50A |
| Applicable Substrate size | 50mm square to 330 x 250 mm |
| Applicable IC size | 1 mm square to 20 mm square |
| Dry cycle time | 1.8 s / IC *1 |
| Bonding accuracy | 3µm/3̌ *2 |
| IC supply method | Wafer supply: up to 300 mm (12 inch) diameter. Tray supply: 2 inch square, 4 inch square |
| Bonding pressure | 5 N - 490 N |
| Bonding heat temperature | up to 500 degree C. |
Full Auto
| Electric source | Triple phase AC 200 V ±10V, 6kVA (optional head heater: sinlge-phase AC 100 V ±10V, 3 kVA) |
| Pneumatic source | 0.49 MPa (500 L/min, 400 L/min, 50 L/min) (A.N.R.) |
| Dimensions | W 1,665 mm x D 1,815 mm x H 1,800 mm *3 |
| Mass | 3,000 kg *4 |
Semi Auto
| Electric source | Triple phase AC 200 V ±10V, 6kVA (optional head heater: sinlge-phase AC 100 V ±10V, 3 kVA) |
| Pneumatic source | 0.49 MPa (400 L/min, 400 L/min, 50 L/min) (A.N.R.) |
| Dimensions | W 1,055 mm x D 1,480 mm x H 1,800 mm *3 |
| Mass | 2,000 kg *4 |
Downloads
*1: Full Auto, dry cycle time*2: Accuracy measured using our boards and ICs for evaluation heating*3: Tolerance ±5mm*4: Varies with Unit configuration