FCX501
- Main control boards are lead free
- GHG Factor 2.43
- Resource Factor 1.44 (Ref. Product: FCB2M)
Description
Ultra sonic flip chip bonder
Ideally suited to the mass production of compact high frequency electronic components
Specifications
| Model No. | KXF-D07D |
| Max speed | 0.7 s/die (bonding time not included) |
| Bonding accuracy | ±10 µm |
| Substrate dimensions | L 50 mm x W 30 mm to L 101.6 mm x W 101.6 mm |
| Die dimensions | L 0.3 mm x W 0.3 mm to L 3.0 mm x W 3.0 mm (Option: L 10.0 mm x W 10.0 mm) |
| Die supply method | max. 6 inch or 8 inch wafer (Option auto wafer changer) |
| Bonding load | 1 N to 50 N (max. 100 N in case of another high bonding force model) |
| Heating type | Substrate: constant heating (max. 200 ºC) |
| Electric source | 3-phase AC 200 V, 3 kVA |
| Pneumatic source | 0.45 MPa, 150 l/min (A.N.R.) |
| Dimensions | W 1,000 mm x D 1,050 mm x H 1,430 mm |
| Mass | 1,300 kg |